Intel Achieves Mass Production of Groundbreaking 3D Packaging Technology Foveros

January 25, 2024 – In a significant announcement today, Intel revealed that it has achieved mass production utilizing industry-leading semiconductor packaging solutions, highlighting its groundbreaking 3D packaging technology known as Foveros. This technological milestone was reached at Intel’s newly upgraded Fab 9 facility in New Mexico, USA. Keyvan Esfarjani, Executive Vice President and Chief Global…

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“Xingyun Smart Driving” On Board: VW and Xpeng’s Co-Created ID.Unyx 09 Lines Up H2 Launch with Flagship Intelligent Specs

July 13, 2026 – Volkswagen Passenger Cars China CEO Zecai Qi officially kicked off the pre-launch campaign for the all-new ID.Unyx 09 on July 10, confirming that the premium all-electric fastback sedan will hit the Chinese market in the second half of 2026. Developed in a tight 24-month joint R&D cycle between Volkswagen and Xpeng,…

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