Intel Rolls Out 5593 Beta Driver, Bolstering Support for ‘The First Descendant’ and More

June 28, 2024 –Intel has recently released the 101.5593 Beta graphics driver tailored for its Arc series of graphics processing units (GPUs). This update primarily focuses on enhancing compatibility and performance for two notable games: “Final Fantasy XIV: Endwalker” and “The First Descendant.” While the new driver doesn’t address any existing issues, Intel has identified…

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Intel Spins Off FPGA Business as New Independent Company ‘Altera’ to Bolster AI and Edge Capabilities

March 01, 2024 – In a significant move, Intel has announced the formation of a wholly-owned and independently operated FPGA company, “Altera,” following the establishment and independent accounting of Intel Foundry. Known for inventing the world’s first programmable logic device, particularly renowned for its FPGA technology, Altera was acquired by Intel in 2015 for $16.7…

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Faraday Technology Announces Plans for World’s First 64-Core Arm Neoverse Processor Using Intel 18A Technology

February 06, 2024 – In a recent announcement, chip design company Faraday Technology has unveiled plans to develop the world’s first 64-core processor based on the Arm Neoverse architecture. The estimated completion date is set for the first half of 2025, with production utilizing Intel’s cutting-edge 18A process technology. Intel’s 18A technology, equivalent to the…

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Intel Reports Mixed Q4 2023 Results, Shares Tumble on Weak 2024 Outlook

January 26, 2024 – Intel today unveiled its financial results for the fourth quarter of 2023, revealing a mixed bag of outcomes. The tech giant reported revenues of 154.1billionforthequarter,surpassinganalystexpectationsof151.7 billion and marking a 10% year-over-year increase. Net income for the quarter stood at 27billion,asignificantturnaroundfromthenetlossof7 billion reported in the same period last year. Intel also boasted…

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Intel Achieves Mass Production of Groundbreaking 3D Packaging Technology Foveros

January 25, 2024 – In a significant announcement today, Intel revealed that it has achieved mass production utilizing industry-leading semiconductor packaging solutions, highlighting its groundbreaking 3D packaging technology known as Foveros. This technological milestone was reached at Intel’s newly upgraded Fab 9 facility in New Mexico, USA. Keyvan Esfarjani, Executive Vice President and Chief Global…

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