ITBEAR

TSMC Makes Progress in 2-nm and 1.4-nm Chip Technologies

April 11, 2024 – According to recent reports from the industry chain, Taiwan Semiconductor Manufacturing Company (TSMC) has made significant progress in its 2-nanometer and 1.4-nanometer processes. Sources indicate that TSMC has set a timeline for the mass production of 2-nanometer and 1.4-nanometer chips. The trial production of the 2-nanometer process is slated to commence…

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Samsung Achieves Breakthrough in 16-Layer Hybrid Bonding HBM Technology

April 09, 2024 – According to recent media reports, Samsung Electronics has announced the completion of technology verification for its 16-layer hybrid bonding HBM (High Bandwidth Memory) process. The company has successfully manufactured a working prototype of a 16-layer stacked HBM3 memory using this hybrid bonding technique, indicating that the technology will be utilized in…

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