November 01, 2024 – During the 2024 third-quarter earnings call, Intel CEO Pat Gelsinger confirmed that future processor generations, including Panther Lake, Nova Lake, and their successors, will not directly integrate memory within the package, unlike the Lunar Lake processors.
For clarification, Intel’s Core Ultra 200V “Lunar Lake” series processors utilize a Memory on Package (MoP) solution, which directly integrates 16GB or 32GB of LPDDR5x-8533 memory.
Gelsinger explained that the Lunar Lake processor was initially designed as a niche product aiming for the highest performance and excellent battery life. However, the emergence of the AI PC concept has led to its shipment scale far exceeding previous expectations. Currently, Lunar Lake accounts for a “relatively small but meaningful proportion” of Intel’s overall product portfolio.
CFO David Zinsner also mentioned that Intel’s current prediction for Lunar Lake processor shipments next year is three times that of previous estimates.
Gelsinger emphasized that the MoP design implemented in Lunar Lake is considered a “one-time” solution, and Intel will revert to traditional packaging methods for future products, including Panther Lake, Nova Lake, and their successors, where memory will be separated and located externally.
