November 01, 2024 – During the 2024Q3 earnings call, Kim Jae-june, Vice President of Samsung Electronics’ Memory Business Division, confirmed that the company is preparing optimized and improved versions of HBM3E memory for the next-generation AI GPUs of multiple key clients.
Previously, reports had suggested that Samsung Electronics’ HBM3E business was being hindered by 14nm-class DRAM, as noted by ZDNET Korea.
The executive stated that Samsung’s enhanced HBM3E memory is scheduled to enter mass production sometime in the first half of next year, with specific timelines currently being negotiated with customers. This improved product line is expected to create a larger pool of potential demand for Samsung, beyond existing HBM3E orders.
In the third quarter, Samsung Electronics’ total HBM memory sales increased by over 70% quarter-on-quarter. HBM3E already accounts for 10% of overall HBM sales and is expected to rise to about half in the fourth quarter.
Looking ahead to HBM4 memory, Kim Jae-june mentioned that Samsung is already engaged in custom HBM development for multiple clients. He also emphasized that the current investment focus of the Memory Business Division is on upgrading existing production lines, rather than further expanding manufacturing capacity.
