Samsung Considers Adopting MUF Technology for Next-Gen DRAM: Report

March 04, 2024 – According to recent reports from TheElec, Samsung is considering the application of Molded Underfill (MUF) technology in its next-generation DRAM. The company has recently tested an MR MUF process for 3D-stacked (3DS) memory, which showed improved throughput compared to Thermal Compression Non-Conductive Film (TC NCF) but experienced some deterioration in physical…

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Samsung Unveils Industry-First 36GB 12H HBM3E DRAM, Revolutionizing AI and High-Capacity Memory Markets

February 27, 2024 – Samsung Electronics announced today that it has successfully developed the industry’s first 36GB 12H (12-layer stacked) HBM3E DRAM, solidifying its leadership position in the high-capacity HBM market. Utilizing TSV (Through Silicon Via) technology, Samsung achieved the industry’s largest 36GB HBM3E 12H capacity by stacking 24Gb DRAM chips to 12 layers. This…

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Samsung Galaxy S24 Ultra Claims Top Spot in DXOMARK Screen Rankings with Impressive 155 Score

February 01, 2024 – The renowned evaluation agency DXOMARK has recently unveiled the screen score for Samsung’s latest flagship smartphone, the Galaxy S24 Ultra. According to the report, the Galaxy S24 Ultra achieved an impressive overall screen test score of 155, topping the global screen rankings on DXOMARK. This places it ahead of various other…

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