Hardware
Apple Secures Patent for Enhanced Digital Crown with Touch and Light Sensors
February 21, 2024 – In a recent development, the United States Patent and Trademark Office (USPTO) has granted a patent to Apple Inc. for a technology related to the Apple Watch, integrating touch and light sensors into the Digital Crown. According to the patent description, the “Digital Crown is equipped with a photosensitive surface that…
Samsung Launches Adorable Panda-Themed Galaxy Buds 2 Pro Bao Package in South Korea
February 19, 2024 – Samsung has recently announced the launch of a unique and adorable addition to its product line in South Korea, the “Galaxy Buds 2 Pro Bao Package.” This special edition is inspired by the birth of two pandas, “Rui Bao” and “Hui Bao,” who were born on July 7, 2023, at the…
Meta Overhauls UI for Quest Headsets, Promises Richer Mixed Reality Experience
February 18, 2024 – Meta’s Chief Technology Officer, Andrew Bosworth, has announced that the company is undertaking a “fundamental UI infrastructure overhaul” for its Meta Quest headsets. This overhaul aims to deliver an enhanced user experience and a “richer environment” for users. During the latest Ask Me Anything (AMA) session on Instagram on February 14th,…
Voigtlander Introduces COLOR-SKOPAR 18mm F2.8 Aspherical Lens for Fujifilm X-Series Cameras
February 18, 2024 – Voigtlander has announced the release of its COLOR-SKOPAR 18mm F2.8 Aspherical wide-angle lens, compatible with Fujifilm’s X-series APS-C cameras via the X-mount. With an effective focal length equivalent to the widely used 28mm wide-angle focal length in the APS-C format, this lens boasts a minimum focusing distance of 0.17m. It features…
Sony’s Upcoming WH-XB920N Headphones: Bluetooth 5.2, Enhanced ANC, and More
February 16, 2024 – Sony’s newly certified Bluetooth headphones, carrying the model number YY2981, are anticipated to be the successor of the WH-XB910N (model YY2951), tentatively named the WH-XB920N. This upcoming model boasts support for Bluetooth 5.2, offering improved connectivity and range. Recent sightings of the headphones at ATT Bolivia have revealed some intriguing technical…
Apple Vision Pro Hits Shelves at US$3499: Reset Process Raises Data Loss Concerns
February 06, 2024 – The long-awaited Apple Vision Pro, priced at a hefty US$3499 (roughly equivalent to RMB 25,000), has officially hit the shelves. Early adopters of the Vision Pro have raised concerns about the potential hassle of losing access to their device in the event of a forgotten password. Apple has clarified that in…
Mark Gurman Compares Apple’s Vision Pro to iPad, Foresees Potential Replacement
February 05, 2024 – In his recent commentary, renowned tech analyst Mark Gurman likened Apple’s inaugural mixed reality headset, Vision Pro, to an iPad, emphasizing its current focus on multimedia entertainment, video conferencing, and lightweight mobile computing. Gurman’s observations come just days after the official launch of the much-anticipated device. While acknowledging the limited time…
Made in China: Apple’s Vision Pro Headset Takes Off with Keen Fans Worldwide
February 04, 2024 – The Vision Pro head-mounted display, touted by Apple as the next generation of “spatial computing device,” has officially gone on sale in the United States, priced at a starting point of $3,499 (approximately equivalent to 25,000 yuan). Despite the steep price tag, the enthusiasm of Apple fans remains unwavering. Analyst Ming-Chi…
Apple Adds 2012 MacBook Pro to List of Vintage Products, Marking End of an Era for CD/DVD-Equipped Macs
February 01, 2024 – Apple has recently updated its list of vintage and obsolete products worldwide, with the notable addition of the MacBook Pro (13-inch, Mid 2012) model, marking the last Mac sold by the company to feature a built-in CD/DVD drive. First released in June 2012, this particular 13-inch MacBook Pro continued to be…
Intel Achieves Mass Production of Groundbreaking 3D Packaging Technology Foveros
January 25, 2024 – In a significant announcement today, Intel revealed that it has achieved mass production utilizing industry-leading semiconductor packaging solutions, highlighting its groundbreaking 3D packaging technology known as Foveros. This technological milestone was reached at Intel’s newly upgraded Fab 9 facility in New Mexico, USA. Keyvan Esfarjani, Executive Vice President and Chief Global…