ITBEAR

Samsung Unveils Industry-First 36GB 12H HBM3E DRAM, Revolutionizing AI and High-Capacity Memory Markets

February 27, 2024 – Samsung Electronics announced today that it has successfully developed the industry’s first 36GB 12H (12-layer stacked) HBM3E DRAM, solidifying its leadership position in the high-capacity HBM market. Utilizing TSV (Through Silicon Via) technology, Samsung achieved the industry’s largest 36GB HBM3E 12H capacity by stacking 24Gb DRAM chips to 12 layers. This…

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Microsoft Unveils New AI Access Principles at MWC 2024, Emphasizing Support for Developers and Social Responsibility

February 27, 2024 – At MWC 2024, Microsoft unveiled its latest set of principles for artificial intelligence (AI) access, citing the need to address the growing role and responsibility of the company as an innovator and market leader in AI. According to Microsoft, AI, like other general-purpose technologies in the past, is creating new economic…

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Vision Pro Teardown Reveals Component Costs and Suppliers

February 26, 2024 – According to Japanese media reports, research firm Fomalhaut Techno Solutions has conducted a teardown analysis of the Vision Pro, identifying the manufacturers of its key components and estimating their procurement prices. The cost of the device and its components is estimated to be approximately 1,200,whichisroughlyone−thirdofitssellingpriceof3,499. In terms of cost breakdown by…

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