TSMC CFO Reveals: Received First $1.5 Billion Payment from US CHIPS Act in Q4 2024

January 21, 2025 – In a recent interview with CNBC, Chief Financial Officer (CFO) of Taiwan Semiconductor Manufacturing Company (TSMC), Huang Renzhao, revealed that the company has secured its first payment of $1.5 billion from the US CHIPS Act in the fourth quarter of 2024.

This funding comes as part of a larger agreement reached between TSMC and the US government on November 15, 2024. Under the terms of this agreement, TSMC has committed to investing over 65billiontobuildthreeadvancedsemiconductorfabsinArizona.Inreturn,theUSgovernmentwillprovide6.6 billion in direct subsidies and $5 billion in loans.

The first of these fabs, operated by TSMC’s subsidiary TSMC Arizona, is already in production. Fab 21, which offers 4-5nm process technology, began mass production of N4P node chips late last year. Initial products from this fab are expected to include older models of Apple’s A-series application processors.

Looking ahead, TSMC Arizona has plans to construct two additional fabs targeting even more advanced process technologies. A 3nm facility is scheduled to start production in 2028, while a production line for 2nm and 1.6nm processes is expected to be operational by the end of the decade.

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