July 13, 2024 – According to a report by ZDNet Korea, Micron’s HBM3E memory encountered a packaging defect last month, causing heating issues and disrupting the mass production process.
Micron announced the mass production of its HBM3E memory based on the 1β process on February 26, 2024, and began supplying NVIDIA with the memory in the second quarter for use in the H200 AI GPU.
Additionally, according to Taiwan’s “Commercial Times,” NVIDIA’s H200 chip entered mass production in late April and is expected to begin large-scale delivery in the third quarter.
The Korean media outlet stated that Micron’s responsibility in this defect is minimal as the issue arose from the 2.5D packaging level rather than the HBM product itself.
Some analysts believe that the problem with Micron’s HBM3E memory was caused by the use of incorrect materials during the packaging process at TSMC.
In its fiscal third-quarter 2024 earnings report (ended May 30, 2024), Micron indicated that HBM3E memory generated over $100 million in revenue in the previous quarter, and further income growth is expected in the future.
