August 21, 2023 – In a groundbreaking announcement today, SK Hynix unveiled their latest achievement in the world of advanced computing. The South Korean tech giant proudly introduced their revolutionary HBM3E, a cutting-edge DRAM product tailored for the burgeoning realm of artificial intelligence. This trailblazing development marks a significant leap forward in memory technology, promising to redefine data processing speeds and reshape the landscape of AI-driven applications.
Derived from the High Bandwidth Memory (HBM) technology lineage, HBM3E stands as the fifth generation of this innovation. The journey from HBM to HBM3E represents a progressive evolution, each iteration enhancing the memory’s capabilities and performance. SK Hynix’s pursuit of excellence has led them to craft an extended version of HBM3, unlocking new realms of possibilities for data-intensive tasks.
The standout feature of HBM3E lies in its unparalleled speed and throughput. Capable of processing a staggering 1.15 terabytes of data per second, it exemplifies a new paradigm of data-handling prowess. To put this into perspective, this monumental speed equates to effortlessly processing 230 Full-HD movies, each spanning 5 gigabytes, in the span of just a single second.
However, SK Hynix’s breakthrough does not end at speed alone. The technical team has harnessed the power of Advanced MR-MUF technology to bolster thermal performance by an impressive 10% compared to its predecessor. This leap in cooling efficiency not only ensures sustained high performance but also exemplifies SK Hynix’s commitment to pushing the boundaries of technological innovation.
The company’s forward-thinking approach is further demonstrated by the seamless integration of HBM3E into existing architectures. With backward compatibility designed into HBM3E, clients utilizing HBM3-based systems can effortlessly transition to the new product without requiring any modifications to their designs or structures. This strategic move showcases SK Hynix’s dedication to providing practical solutions that seamlessly adapt to the ever-evolving needs of the industry.
Ian Buck, Vice President of NVIDIA’s Hyperscale and HPC division, lauded the collaborative journey between NVIDIA and SK Hynix. He emphasized the long-standing partnership between the two industry leaders, particularly in the realm of high-performance computing. With NVIDIA’s unrelenting focus on accelerating computing solutions and SK Hynix’s breakthrough in HBM3E, the future holds the promise of unparalleled advancements in AI computing.
