Samsung Achieves Breakthrough in 16-Layer Hybrid Bonding HBM Technology

April 09, 2024 – According to recent media reports, Samsung Electronics has announced the completion of technology verification for its 16-layer hybrid bonding HBM (High Bandwidth Memory) process. The company has successfully manufactured a working prototype of a 16-layer stacked HBM3 memory using this hybrid bonding technique, indicating that the technology will be utilized in…

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Samsung Unveils Design Identity 5.0: A Vision for the Future

April 08, 2024 – Samsung Electronics has recently unveiled their latest press release, with the company’s Mobile Division President, Taiwon Lu, discussing Design Identity 5.0 and introducing a brand new core concept of Essential∙Innovative∙Harmonious, set to be implemented across their range of smartphones, wearables, and televisions by 2030. Lu expressed that Samsung has redefined its…

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Samsung Electronics’ Shareholder Returns Surpass Tech Giants Amid Industry Downturn

April 02, 2024 – Samsung Electronics’ shareholder returns have been under the spotlight recently, with investors expressing dissatisfaction with the current yields. They are urging the company to increase its dividend payouts and take other measures to boost its stock price. Surprisingly, despite facing a significant downturn in the memory chip industry, which has been…

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