July 04, 2024 – According to a report by the Korean media outlet NewDaily, Samsung Electronics has successfully passed the quality testing for NVIDIA’s HBM3e (High-Bandwidth Memory). This significant milestone indicates that Samsung is now poised to commence mass production of HBM memory chips, and the company is currently engaged in negotiations with NVIDIA regarding supply issues.
Recently, Samsung Electronics received a Product Readiness Approval (PRA) notification from NVIDIA for the HBM3e quality test. This achievement comes after Samsung, in response to NVIDIA’s request, dispatched executives responsible for HBM memory development to the United States for over a month.
Previously, in March of this year, NVIDIA CEO Jensen Huang stated that the company had begun validating Samsung’s HBM memory chips. However, in May, rumors surfaced that Samsung’s HBM memory chips had failed NVIDIA’s tests due to heating and power consumption issues. At the 2024 Taipei International Computer Show, Huang clarified that Samsung’s HBM memory is still under certification and denied any reports of it failing NVIDIA’s tests.
Foreign media outlets suggest that Samsung is eager to supply HBM to NVIDIA, and passing the latter’s tests signifies a potential “leap” in HBM’s performance starting from the second half of the year. This positive news has impacted the stock market, with Samsung Electronics’ shares rising by 3.6% on July 4th, reaching their highest point since April 12th. Conversely, SK Hynix, one of NVIDIA’s primary HBM memory suppliers, experienced a 4.7% drop in its stock price, marking the largest decline since June 24th.
