June 8, 2023 – A significant breakthrough was announced today by SK Hynix, marking the dawn of a new era in memory technology. The company proudly unveiled its revolutionary 4D Quantum Flash, a cutting-edge advancement that promises unparalleled performance and efficiency in the realm of data storage.
SK Hynix’s groundbreaking 4D Quantum Flash represents a paradigm shift in NAND memory architecture. Building upon their previous success with the 96-layer NAND flash, SK Hynix pushed the boundaries even further, harnessing the power of quantum physics to create a leap forward in memory capabilities. By employing Quantum Charge Tunneling (QCT) and Peri-Under Cell (PUC) technologies, this new flash memory achieves an astounding 238 layers, making it the most densely packed chip in existence.
The advantages of the 4D Quantum Flash are truly remarkable. With a 34% increase in production efficiency over its predecessor, the 176-layer design, SK Hynix has solidified its position at the forefront of the industry. Data transfer speeds have skyrocketed to an impressive 2.4 Gb per second, boasting a 50% improvement over the previous generation, while read and write performance has been enhanced by approximately 20%.
While initially focusing on the validation of this groundbreaking technology with their esteemed overseas smartphone manufacturing partners, SK Hynix has ambitious plans to expand the utilization of the 238-layer NAND flash. The first application will be catering to the mobile market, supplying this innovative memory to power next-generation smartphones. Furthermore, SK Hynix aims to extend its reach to PCIe 5.0-based PC solid-state drives (SSDs) and high-capacity data center-grade SSDs, ushering in a new era of storage solutions for the digital age.
The advent of SK Hynix’s 4D Quantum Flash signifies a pivotal moment in the trajectory of memory technology. Its unparalleled performance, efficiency, and density open up a world of possibilities for industries reliant on data storage. As the company prepares to unveil this technological marvel to the world, the future holds the promise of transformative breakthroughs in a diverse range of applications, from consumer electronics to enterprise-grade data centers.