TSMC Makes Progress in 2-nm and 1.4-nm Chip Technologies

April 11, 2024 – According to recent reports from the industry chain, Taiwan Semiconductor Manufacturing Company (TSMC) has made significant progress in its 2-nanometer and 1.4-nanometer processes. Sources indicate that TSMC has set a timeline for the mass production of 2-nanometer and 1.4-nanometer chips. The trial production of the 2-nanometer process is slated to commence…

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Samsung Achieves Breakthrough in 16-Layer Hybrid Bonding HBM Technology

April 09, 2024 – According to recent media reports, Samsung Electronics has announced the completion of technology verification for its 16-layer hybrid bonding HBM (High Bandwidth Memory) process. The company has successfully manufactured a working prototype of a 16-layer stacked HBM3 memory using this hybrid bonding technique, indicating that the technology will be utilized in…

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Elon Musk Predicts AI Will Outsmart Humans by 2026

April 09, 2024 – In a recent interview, Elon Musk predicted that artificial intelligence could potentially surpass the intelligence of the brightest humans by next year or 2026 at the latest. According to Musk, “If we define general artificial intelligence as having an intellect exceeding that of the smartest human, I believe it could happen…

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