August 20, 2024 – According to a report by Korean media MK, Ryu Seong-soo, the Vice President of SK Hynix responsible for the HBM memory business, stated at the 2024 SK Group Icheon Forum that tech giants, collectively known as the M7, have expressed their intention for SK Hynix to develop customized HBM products.
The M7, or Magnificent 7, refers to the seven major technology companies listed on the US stock market: Apple, Microsoft, Alphabet (Google), Tesla, NVIDIA, Amazon, and Meta.
During his speech, Ryu Seong-soo mentioned that he had been working tirelessly, even on weekends, communicating with the M7 companies via phone and coordinating engineering resources across SK Hynix and supply chain enterprises in South Korea to meet their needs.
The executive believes that the storage industry is on the verge of a paradigm shift as demand for customized products increases. SK Hynix intends to leverage these opportunities to further develop its memory business.
Furthermore, Ryu Seong-soo emphasized that with the segmentation of the AI market, SK Hynix plans to not only continue providing solutions for the mass market but also introduce differentiated products with performance capabilities 20 to 30 times higher than existing models.
Previous reports indicate that SK Hynix anticipates launching a 12-layer stacked HBM4 memory product utilizing MR-MUF bonding technology in the latter half of 2025. Additionally, a higher-capacity 16-layer stacked HBM is expected to be released in 2026 when the demand arises.
