Samsung Electro-Mechanics Speeds Up Semiconductor Glass Substrate Development

May 09, 2024 – According to a report by ETNews citing informed sources, Samsung Electro-Mechanics has advanced the completion date of its semiconductor glass substrate pilot line to September, marking a quarter earlier than the originally planned end-of-year deadline.

Glass substrates offer significant advantages over existing organic substrates in terms of electrical and thermal performance, enabling further reduction in thickness. Additionally, they facilitate novel circuit connections like Through Glass Via (TGV), making them particularly suitable for chips in the HPC and AI domains.

During CES 2024, Samsung Electro-Mechanics declared its foray into the semiconductor glass substrate sector, unveiling a roadmap that includes establishing a pilot line in 2024, sampling in 2025, and full-scale production in 2026.

Meanwhile, Absolic, a joint venture between SKC and Applied Materials, currently leads the glass substrate industry in progress. Recently, Absolic has moved up the launch of its initial project at its glass substrate factory in Georgia, USA, from the fourth quarter to the second quarter.

In this context, Samsung Electro-Mechanics is accelerating its research and development process to narrow the gap with its competitors.

Industry insiders reveal that Samsung Electro-Mechanics has already selected equipment suppliers for its glass substrate pilot line, including Philoptics, Jungjin Tech, and overseas companies Chemtronics and LPKF Laser & Electronics. The production line is expected to be operational as early as the fourth quarter of this year.

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