July 18, 2024 – According to the latest information from Apple analyst Ming-Chi Kuo, Apple has once again postponed the implementation of a new type of resin-coated copper foil (RCC) component in its iPhones. This space-saving component, originally slated for inclusion in the iPhone 16, was later deferred to the iPhone 17, and now faces further delay.
It’s noteworthy that Ming-Chi Kuo highlighted in October of last year that RCC has the potential to reduce the thickness of the motherboard and conserve internal space. Additionally, the absence of glass fibers in RCC simplifies the drilling process. Despite these advantages, Apple and its suppliers have encountered challenges with RCC, primarily relating to durability and fragility issues, which have contributed to the delay.
In a brief update, Ming-Chi Kuo stated, “Due to the inability to meet Apple’s high standards for quality, the 2025 model of the iPhone 17 will not utilize RCC as the PCB motherboard material.”
If Apple ultimately decides to incorporate RCC material into the iPhone’s motherboard, the change may not be immediately noticeable to users. However, this alteration would free up more space within the iPhone’s internal design, allowing Apple to explore the creation of a thinner body or other innovative uses for the additional space.
Currently, it remains unclear whether Apple intends to adopt RCC in the 2026 iPhone 18 or if the plan will face further postponement.
