October 14, 2026 – Huawei held a Kirin chip technology briefing, revealing that cumulative shipments of devices powered by Kirin chips have surpassed 100 million units since 2023.
The Kirin 9000S, which debuted in the Mate 60 series in 2023, marked the chip’s return. In September 2025, Huawei unveiled the Kirin 9020 in the Mate XTs Ultimate Design. Now, the Kirin 9050 Pro has officially arrived, first appearing in the Mate XT 2 Ultimate Design.
Unlike conventional SoCs, the Kirin 9050 Pro introduces “logic folding,” a technique Huawei describes as “time scaling.” Instead of only shrinking transistors on a flat plane, it shortens internal signal paths by stacking logic and memory layers vertically through wafer-to-wafer hybrid bonding. This reduces transmission delay and improves density without relying solely on finer process nodes. Huawei says the approach is not a simple chip stack; it requires redesigning circuits in three dimensions and addressing heat, yield and interconnect challenges. It can also coexist with advanced development.
Huawei also highlighted its system-level integration across chips, hardware, operating systems and cloud services as a key advantage in improving real-world user experience.
