Microsoft Quietly Removes Windows Subsystem for Android from Windows 11
March 06, 2024 – In a recent and understated update to its technical support documentation, Microsoft has revealed that the Windows Subsystem for Android (WSA) has been removed from Windows 11. This development effectively dashes the widely touted and eagerly anticipated prospect of running Android applications and games on personal computers. The integration of PC…
Microsoft Introduces New Hover-to-Launch Feature for Copilot in Windows 11 Preview Update
March 06, 2024 – In a recent development, Microsoft has announced a new way to launch Copilot in the Windows 11 Preview update KB5034857. According to the tech giant, users will now be able to hover their mouse over the Copilot taskbar button, eliminating the need for a click, to automatically open the Copilot window….
Sony Rumored to Unveil Groundbreaking Ultra-Large Aperture Lens
March 05, 2024 – According to recent reports from SonyAlphaRumors, Sony is gearing up to announce an unprecedented ultra-large aperture lens that has never been achieved by any manufacturer in the history of photography. The specifications of this lens are said to be groundbreaking, marking a significant milestone in the industry. SonyAlphaRumors has indicated that…
Samsung SDI to Lead EV Revolution with 2027 Mass Production of All-Solid-State Batteries
March 05, 2024 – In a move that is set to revolutionize the electric vehicle (EV) industry, Samsung SDI has announced plans to commence mass production of all-solid-state batteries (ASB) by 2027. The announcement, made ahead of the upcoming InterBattery 2024 exhibition, outlines the company’s preparations in the ASB field, positioning it as a solution…
Windows 11 Embraces USB4 2.0 and Hints at Wi-Fi 7 Support in Latest Update
March 05, 2024 – In a recent development, Microsoft has quietly introduced support for USB4 2.0 in its latest Windows 11 update, sparking excitement among users. With this update, Windows 11 now boasts support for 80Gbps USB4 connections, marking a significant leap forward in data transfer speeds. The updated operating system versions, 22621.3235 and 22631.3235,…
Anthropic Unveils Claude 3: A New Era in AI with Superior Performance over GPT-4
March 05, 2024 – In a surprising turn of events, Anthropic, a major competitor of OpenAI, has unveiled its latest large language model family, Claude 3, which, for the first time since the release of GPT-4, appears to have surpassed it across multiple benchmarks. According to official test results released by Anthropic, Claude 3 demonstrates…
Mercedes-Benz and BMW Joint Venture Lands in Beijing Chaoyang to Boost EV Charging Infrastructure
March 05, 2024 – Beijing Chaoyang District welcomes the official establishment of Beijing Yi’anqi New Energy Technology Co., Ltd., a joint venture between Mercedes-Benz and BMW with a 50:50 equity ratio. This significant development marks a new chapter in the collaborative efforts of these two automotive giants in the Chinese market. On November 30, 2023,…
Copilot Introduces New AI Feature: Drag-and-Drop File Questioning
March 04, 2024 – In a bid to alleviate the burden of reading lengthy documents for users, technology companies have been actively harnessing the power of AI models. Following Adobe’s introduction of PDF AI to aid in the quick comprehension of voluminous reports, and Copilot’s ability to analyze OneDrive files and respond to pertinent queries,…
Aston Martin Focuses on Performance, Not Luxury, Despite Record Prices
March 04, 2024 – Despite experiencing a surge in its average selling price to a record-breaking £213,000 (approximately 1.94 million Chinese yuan) due to high levels of personalized customization, Aston Martin has stated that it has no intention of entering the luxury car market. Previously, under the leadership of former CEO Andy Palmer, Aston Martin…
Samsung Considers Adopting MUF Technology for Next-Gen DRAM: Report
March 04, 2024 – According to recent reports from TheElec, Samsung is considering the application of Molded Underfill (MUF) technology in its next-generation DRAM. The company has recently tested an MR MUF process for 3D-stacked (3DS) memory, which showed improved throughput compared to Thermal Compression Non-Conductive Film (TC NCF) but experienced some deterioration in physical…