July 05, 2024 – In the competitive mobile phone market, where leading players boast their own SoC (System on a Chip) technology, it was only natural for tech giant Google to forge its own path in chip manufacturing.
Starting with the Pixel 6 series, Google’s Pixel models have been equipped with the company’s customized Tensor chips. These chips were originally modified versions of Samsung’s Exynos, with only the TPU (Tensor Processing Unit), ISP (Image Signal Processor), and the integrated Titan M2 security chip being proprietary Google technology.
However, with the advent of Tensor G5, Google is poised to achieve full autonomy in chip development. Reports indicate that the Tensor G5 will be manufactured by TSMC using a 3nm process and has already entered the tape-out phase.
Tape-out, analogous to a production line, refers to the series of steps in chip manufacturing that bridges the gap between chip design and mass production. It is a crucial stage in the chip-making process.
If the tape-out is successful, it paves the way for large-scale chip production. On the other hand, any issues identified during this phase require troubleshooting and design optimization.
As per the plan, Google’s Tensor G5 is slated to make its debut next year, with the Pixel 10 series being the first to feature this new chip.
Analysts view the Tensor G5 as a significant milestone for Google, marking a substantial breakthrough in the hardware capabilities of the Pixel phones. This development is also seen as a key step in Google’s bid to challenge the iPhone and strengthen its position in the high-end mobile phone market.
