August 2, 2025 – As new CEO Lip-Bu Tan drives sweeping changes at Intel, the tech giant has announced the impending retirement of three senior executives overseeing its crucial wafer fabrication operations.
On Tuesday, the company informed employees that Kaizad Mistry and Ryan Russell, both corporate vice presidents in the Technology Development Group, will step down from their roles. Gary Patton, another corporate vice president leading the Design Technology Platform Organization and a former IBM executive, is also set to retire.
Sources familiar with the matter told Reuters that Intel is contemplating structural adjustments within its Technology Development Group, which handles semiconductor manufacturing processes. The proposed changes include downsizing the manufacturing capacity planning team and trimming certain engineering units, though the company declined to comment on these developments.
Intel’s manufacturing division operates under Naga Chandrasekaran, a former Micron executive hired in 2024 by then-CEO Pat Gelsinger. Since taking full control of technology development and manufacturing in March, Chandrasekaran has overseen team restructuring efforts, including layoffs tied to the company’s broader workforce reduction plans.
During last week’s quarterly earnings announcement, CEO Tan—who assumed the role in March—set a target to reduce Intel’s global headcount to 75,000 by year-end. He also emphasized stricter oversight of capital investments in chip manufacturing, signaling a more disciplined approach to resource allocation.
The company revealed that its next-generation Intel 14A process technology hinges on securing new external customers, warning that development could be paused or canceled without such partnerships. Meanwhile, Tan stated that the Intel 18A process would only deliver meaningful returns when used for internal products.
These moves underscore Intel’s strategic pivot under Tan, who faces mounting pressure to restore profitability while competing with advanced manufacturing rivals like TSMC and Samsung.
